澳洲幸运10计划平台Blind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers. Blind and buried vias save real estate as features and lines are designed above or below them without connection. Fine pitch BGA and flip-chip component footprints restrict traces.
澳洲幸运10开奖号码查询HDI will be critical in reducing the size of LiDAR PCBs for autonomous vehicles. Mobile and wireless technology for Telecommunications and Computing drives the need for smaller vias with increased functionality.
澳洲幸运10三期计划HDI via fill plating boosts production time and increases density and functionality by providing finer lines and spaces. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of any-layer via technology.
HDI sample circuit board: Cu Via Fill
- Desemar and deash
- Hole preparation
- Copper plating and copper filled via
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